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  • Today we are at the GIGABYTE Factory in Nan-Ping, Taiwan

    今天我們來到台灣南平的技嘉工廠。

  • to show from beginning to end, exactly how a GIGABYTE motherboard is made.

    我們將告訴您,主機板的整個製造流程與細節

  • A motherboard uses a lot of components, all of them are assembled on a PCB

    主機板由許多元件構成,這些元件都被裝置在PCB上

  • PCB means Printed Circuit Board

    PCB指的是印刷電路板

  • creating the motherboard you will recognise from inside your PC.

    而在元件與電路板的結合之後,就成為電腦裡面的主機板了

  • The PCB arrives from another factory and the first process is to solder on the board all the SMDs

    PCB送到技嘉工廠的第一道工序是將所有SMD元件焊上板子

  • SMD means Surface mounted devices.

    SMD指的是表面黏著元件。

  • SMD is a term use for all the components that don't have pins going to the other side of the PCB

    SMD 是一種元件安裝的形式,它沒有可以用來穿過PCB以進行焊接的針腳,

  • but have their electrical connections on the edges.

    但它的邊緣有電氣接點

  • like the resistors, bios, audio and sata chips, as well as the chipset itself.

    像音效晶片或者晶片組都是這樣的架構形式.

  • Every part of the PCB that will be in electrical contact with a component gets coated with a special soldering paste

    PCB每個與電氣層接觸部份,都會透過特殊錫膏與元件連結。

  • The solder paste acts like glue for all these chips before going into the reflow oven for definitive soldering.

    錫膏的功用像膠水一樣,協助所有的晶片進入錫爐進行最終焊接。

  • In that way every small component is in the right position before soldering.

    透過這種方式,所有小元件都可以在焊接前被固定在正確的位置。

  • As you can see, the solder paste is applied on the PCB space only in places where you will have components.

    正如您可以看到的,焊膏只會附著在元件週邊的PCB空間。

  • All motherboards today have dozens of very small and thin SMD components that are directly placed on the board.

    今日的主機板都有很多輕薄短小的小元件直接黏著在板子上,稱之為SMD

  • The high speed Chip Placer can place from 5 to 10 components per second. It's incredibly fast.

    這台高速晶片放置器每秒可以放5-10個元件,它真的很快。

  • Most of the components mounted by these machines are around a millimeter wide

    這些機器安裝的元件大多只有1毫米寬。

  • and must be very precisely placed on the PCB.

    且必須非常精確地放置在PCB上。

  • Today's motherboards have components on both sides,

    今日的主機板,正反兩側都有安設很多元件,

  • the first side that goes into the factory process is the reverse side.

    進入產線會先處理背面。

  • Once the reverse is done,

    等背面處理好之後,

  • a machine switches the motherboard to the front side

    機器會把主機板翻到另一面

  • and the process starts again on the SMT Line.

    並在SMT 產線再次開始處理工作。

  • After the small components, it's time to mount the chipset

    當這些小元件都搞定之後,就該安裝晶片了,

  • CPU socket and all the other chips that will made your motherboard work.

    而所有的晶片都是用來驅使主機板運作的,喔,對了,還有CPU的腳座。

  • Before being placed on the motherboard,

    在被放上主機板之前,

  • each chip is first verified by different sets of lights to check if there is any problem

    每個晶片都要先經過不同光波設定的照射驗證,以檢查是否有任何問題

  • with the soldering points or alignment of the chip.

    並確認和接點與晶片是否有對齊。

  • You can see that chips like the chipset, audio, SATA and USB ICs

    你還可以看到其他晶片,諸如音效、SATA跟USB3.0

  • are placed on the board by this machine The same goes for the CPU Socket.

    都透過這台機器裝設到主機板上,當然CPU腳做的處理方式也一樣

  • For example, all chips that are bigger than your finger are placed by this machine.

    舉例來說,所有比您手指頭大的晶片,都由這台機器來配置。

  • Now that your motherboard has SMDs on the board, it is ready to go to the Reflow Oven for the soldering process.

    在這個時候,你主機板上所有的SMD都已經配置完成,等待過錫爐。

  • The soldering paste is melted at very high temperatures, sticking the components to the PCB.

    錫膏在高溫下溶解,並把元件跟PCB緊密結合。

  • Temperatures reach as high as 245°C as the motherboard moves through the different levels.

    主機板在高達245°C的錫爐中不同層次移動。

  • At this point electrical and mechanical connections are made.

    在這個時間點,電氣接點與機械接點完成結合。

  • Now that your motherboard has all the small resistors as well as the major chips and the CPU socket

    現在你的主機板上已經配置有小電阻以及晶片和腳座

  • it's time for the visual inspection.

    該進行視覺檢查了

  • This inspection ensures there are no misplacements or missing parts.

    這個檢查,主要是避免錯位或缺件的情況。

  • Components smaller than 2 millimeters cannot be checked by visual inspection, but this is why we have the AOI machine.

    然而這些小元件可能小於2毫米,很難用肉眼睛確檢查,需要AOI的輔助。

  • The Automated Optical Inspection machine checks if there are any missing or misplaced components.

    自動光學檢測機,可以檢查出是否有任何遺漏或放錯地方的元件。

  • It also checks all the components that have visible soldering point, like the audio chip.

    同時它也可以檢查像音效晶片這一類所有晶片的焊點是否完整。

  • And finally the ICT, or Integrated Chip Tester stage, can verify that every chip that has soldering point below,

    同時,最後的ICT (Integrated Chip Tester) can verify if every chip that has soldering point below them,

  • like the chipset, is well connected.

    like the chipset, is well connected.

  • It tests if the chip is well-soldered electrically to the board,

     It tests if the chip is well-soldered electrically to the board,

  • but does not test if the chipset itself is working.

    but does not test if the chipset itself is working exactly.

  • This factory floor is dedicated to additional verification, especially for server components.

    This factory floor is dedicated to additional verification, especially for server components.

  • Some boards are tested by X-Ray to verify the quality of soldering.

    Some boards are tested by X-Ray to verify the quality of soldering.

  • This inspection is a high quality service that allows very high-end and server board to be checked in more depth.

    This inspection is a high quality service that allow very high end and server board to be checked in more depth.

  • And server board to be checked in more depth.

    And server board to be checked in more depth.

  • Once these last tests are made after the SMT stage, it's time to go to the DIP or Dual Inline Package stage.

    Once these last tests are made after the SMT it's time to go to the DIP (Dual Inline Package)

  • The DIP stage is the second major process when making a motherboard.

    The DIP stage is the second big important process when making a motherboard.

  • First you have manual insertion;

    First you have manual insertion :

  • with all the small components and ICs has been already added

    all the small components and chipset has been added already,

  • it's time to place all the other components that have pins going through the PCB.

    it's time to place all the other components that have pins going through the PCB.

  • During this stage all the components are manually inserted.

    During this stage all the components are manually inserted.

  • You can see a long chain of employees inserting the I/O connectors

    You can see a long chain of employees inserting the In/Out connectors

  • power sockets, PCI-Express and ram slots

    Power plugs, PCI-Express and ram slots,

  • also the chokes and solid capacitors around the CPU Socket.

    and also the chokes and solid capacitors around the CPU Socket.

  • Before being finally soldered on to the PCB

    Before being finally soldered on the boards

  • each inserted part needs to be in the right place and well positioned

    each inserted part need to be in the right place and well positioned,

  • this is the goal of the inspection before the wave soldering.

    this is the goal of the inspection before the wave soldering.

  • The principle of the wave soldering is easy

    The principle of wave soldering is simple,

  • the motherboard has components on one side, with pins going through the PCB

    the motherboard has components on one side, with pins going through the PCB.

  • The Wave Solder touches the back of the PCB

    The Wave Solder touches the back of the PCB

  • and these pins are soldered to attach the components to the board.

    and these pins with melted solder to attach the components to the board.

  • After the Wave Soldering process

    After the Wave Soldering process

  • you usually have residues that are cleaned with a large brush

    you usually have residues that are cleaned with a large brush

  • making the back of your motherboard shiny.

    making the back of your motherboard shinny.

  • Another inspection is made, with manual touching-up with a soldering iron if needed.

    Another inspection is made with some touching up with solder iron if needed.

  • Then heat-sinks are mounted on the board before another inspection

    Then heat-sinks are mounted on the board before another inspection

  • and check-up by the ICT or Integrated Chip Tester.

    and check-up by the ICT (Integrated Chip Tester).

  • Your board is now fully functional,

    Your board is now fully functional

  • but the biggest quality control still needs to be done.

    but the biggest quality control still need to be done.

  • Employees are testing everything. From component connectivity, to the all important burn-in test.

    Employees are testing everything from the connectivity to the burn in test of the mainboard.

  • The Function Box allows easy "Switch ON / Switch Off" of the components

    The Function Box allow easy "Switch ON / Switch Off" of the components

  • as well as peripherals for testing purposes.

    as well as peripherals for testing purposes.

  • As a part of GIGABYTE's rigorous quality testing procedure, 100% of the boards' components are tested

    As a part of GIGABYTE Quality testing 100% of the board are tested in the factory.

  • with basic to advanced functionality fully verified.

    where basic to advanced functionalities are verified.

  • Once the board has passed all the testing and quality Analysis,

    Once the board passed all the testing and Quality Analysis

  • the boards are sent to the next process: The packing.

    the boards are sent to the next process :

  • This is the final step for your motherboard

    This is the final step for your motherboard

  • where it makes its way into the box you'll see in the shop.

    where it makes its way into the box you'll see in the shop.

  • At the factory the boxes are just flat cardboard

    At the factory the boxes are just flat cardboard

  • The packaging starts off as flat packed cardboard boxes that are quickly fashioned into retail boxes by an automatic machine.

    that is quickly fashioned into a retail box by an automatic machine.

  • Employees apply barcodes and references numbers on the boxes,

    Employees stick barcodes and references numbers on the boxes

  • as well as on the board, then scan the different serial numbers.

    as well as on the board, then scan the different serial number.

  • Your board is almost ready.

    You board is almost ready.

  • The bundled accessories that include the manual and drivers DVDs are added,

    You just need add the accessories, manual, Drivers DVD and close the package.

  • Each motherboard box goes into larger boxes ready for shipping (These are then weighed and strapped up before being send to distributers and retailers).

    Each box goes into bigger parcels then weighed and strapped.

  • This ends our video detailing how GIGABYTE Motherboards are made.

    This ends our video, now you know how to make Motherboard in a GIGABYTE factory. �

  • We hope you enjoyed this OverClocking-TV video and look forward seeing you again soon. �

Today we are at the GIGABYTE Factory in Nan-Ping, Taiwan

今天我們來到台灣南平的技嘉工廠。

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如何製作主板--技嘉工廠巡禮視頻介紹 (How to make a Motherboard - A GIGABYTE Factory Tour Video)

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    Peter Yang 發佈於 2021 年 01 月 14 日
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